Designed specifically for extreme temperature testing
RiSHENG air stream systems deliver reliable, repeatable ultra-low temperature
performance for cutting-edge semiconductor and electronics testing
Wide Temp Range: -80°C to +150°C
Single system covers both cold and hot testing. Rapid transition between extreme temperatures without moving DUT
Fast Ramping & High Flow
Up to 15°C/sec cooling/heating rate. Air flow up to 800 SLPM, enabling accurate thermal cycling per JEDEC/MIL-STD
Dry & Contamination-Free
Uses clean, dry air or nitrogen. No condensation, icing, or moisture risk – safe for sensitive wafer/chip testing.
Technical Specifications
Advanced cascade refrigeration technology ensures stable -80°C output even in
ambient conditions up to 35°C
CTS-80 (Ultra-Low Air Stream Series)
Cooling Rate (avg)
Heating Rate
Air Flow Rate
Exhaust / Inlet
Cooling Technology
Chip testing & electronic reliability verification
Trusted by global IC design houses, OSATs, and failure analysis labs for precise
thermal testing
Wafer / Chip Characterization
Parametric test at extreme temperatures, speed binning, defect analysis
Thermal Cycling (TC)
JEDEC / AEC-Q100 reliability stress without moving parts
Failure Analysis (FA)
Localized ultra-cold stimulation, laser/ photon emission microscopy compatibles
Automotive Electronics
Fast Temperature Testing for Automotive Chips: Cockpit, ADAS & Power Modules (-80°C to 125°C)
RF & Power Devices
GaN, SiC, LDMOS characterization under extreme cold conditions
Engineering Validation
Design-of-experiments (DoE) over temperature, early reliability screening
Why go with RiSHENG’s ultra-low temperature cold air system?
Traditional thermal chambers require long stabilization times and cannot provide localized airflow. Our system delivers pinpoint cooling directly to the device under test, reducing test time by >50% and eliminating condensation issues with dry air purge
- Precise DUT temperature control
- No liquid nitrogen required
- 24/7 continuous operation
